Land Grid Array (LGA) Socket Market Size, Trends, Share, Growth, and Opportunity Forecast, 2023 - 2030 Global Industry Analysis By Product Type (Flip Chip LGA Sockets, Pin Grid Array (PGA) Sockets, Land Grid Array (LGA) Sockets with Lead, Others), By Application (Consumer Electronics, Automotive, Aerospace and Defense, Industrial, Telecommunication, Healthcare, Computing Devices, Others), By End-user (Original Equipment Manufacturers (OEMs), Aftermarket), and By Geography (North America, Europe, Asia Pacific, South America, and Middle East & Africa)

Land Grid Array (LGA) Socket Market Size, Trends, Share, Growth, and Opportunity Forecast, 2023 - 2030 Global Industry Analysis By Product Type (Flip Chip LGA Sockets, Pin Grid Array (PGA) Sockets, Land Grid Array (LGA) Sockets with Lead, Others), By Application (Consumer Electronics, Automotive, Aerospace and Defense, Industrial, Telecommunication, Healthcare, Computing Devices, Others), By End-user (Original Equipment Manufacturers (OEMs), Aftermarket), and By Geography (North America, Europe, Asia Pacific, South America, and Middle East & Africa)
Region: Global
Published: March 2024
Report Code: CGNEAS539
Pages: 216

The Global Land Grid Array (LGA) Socket Market was valued at USD 156.3 Million in 2022 and is anticipated to reach a value of USD 258.9 Million by 2030 expanding at a CAGR of 6.6% between 2023 and 2030.

A central processing unit (CPU) socket that employs the land grid array method of integrated circuit packaging is known as an LGA socket. To connect to the motherboard, a number of processors, or CPUs, have pins that fit into the pin holes in the socket. In contrast, the processor has a flat surface and the LGA socket has pins. Another well-known feature of the LGA socket is its relatively high CPU contact concentration. Ball grid array (BGA) and pin grid array (PGA) packaging are linked to LGA packaging. Land grid array packages, in contrast to pin grid arrays, are made to either slide into a socket or be soldered down using surface mount technology. It is not possible to solder down PGA packages using surface mount technique. Land grid array packages with non-socketed designs, in contrast to BGAs, employ flat contacts that are glued straight to the PCB instead of balls. On the other hand, BGA packages use balls as the IC and PCB connections. The balls are secured to the bottom of the IC. The entire LGA Socket market research takes into account all the influencing factors that have caused significant market variations in recent years, including the economic conditions, COVID-19, and the Russia-Ukraine War.

Land Grid Array (LGA) Socket Market Major Driving Forces

Emphasis on R&D: The global market for LGA sockets is driven by investments in research and development aimed at enhancing socket designs, materials, and manufacturing processes to satisfy the ever-evolving demands of high-performance applications.

Embrace Sustainability: Another trend that manufacturers can use to their advantage to compete in the market is the incorporation of sustainable practices in the manufacturing of sockets. Examples of these practices include the use of recyclable materials and the implementation of energy-efficient production processes.

Demand in the Automotive industry: Due to the widespread usage of LGA sockets in automotive electronics, which includes engine control units, infotainment systems, and sophisticated driver-assistance systems, the automotive industry has been a significant factor in the market's growth.

Growth of Consumer Electronics: As smartphones, tablets, and wearable technology become more and more common, there is also a growing need for LGA sockets in the consumer electronics industry.

Land Grid Array (LGA) Socket Market Key Opportunities

Eco-Friendly and Sustainable Options: The market for land grid array (LGA) sockets has a chance to create and encourage environmentally conscious options owing to the increasing requirement for eco-friendly products. Manufacturers can benefit from this development by providing land grid array (LGA) sockets with ethical sourcing, or by utilizing organic and recycled materials.

Miniaturization: As electronic items get smaller and more compact, miniature LGA sockets are required to meet space constraints. Therefore, the worldwide LGA socket market presents an opportunity for producers.

Customization and Personalization: The industry is moving toward customized and application-specific socket designs due to the growing need for bespoke LGA sockets made for certain purposes. Manufacturers of land grid array (LGA) sockets can provide customization choices so that consumers can select the materials, sizes, and designs that best suit their needs. This trend opens up new markets for premium and niche products by increasing customer involvement and brand loyalty.

Land Grid Array (LGA) Socket Market Key Trends

·         The use of LGA sockets, which are more compact and effective.

·         Technological developments in the design and production of LGA sockets.

·         Expanding use in the automotive, aerospace, consumer electronics, and industrial industries.

·         Due to its improved thermal management and electrical performance, flip chip LGA sockets are becoming more and more popular.

·         Growing emphasis on integration and miniaturization.

·         Key players' strategy for market penetration and geographic expansion.

·         Emerging economies particularly in Asia-Pacific region have substantial development prospects.

·         Raising the investment in research and development and technological advancements.

·         Cooperation and strategic alliances between producers and consumers.

Region-wise Market Insights

Asia Pacific accounted for the largest market share at 33.6% in 2022 whereas, it is also expected to register the fastest growth, expanding at a CAGR of 6.8% between 2023 and 2030.

Asia-Pacific is the region which has registered the highest global market share of 33.6%, accounting USD 52.52 Million in 2022 of the global land grid array (LGA) socket market. This region is also expected to grow at the fastest growth rate of CAGR of 6.8%. In Asia-Pacific, the demand is driven by rapid industrialization of emerging economies and more importantly China and India, besides them Japan is another economy which plays a pivotal role in the development of this market. Owing to rapid urbanization and industrialization of the region, the per capita income of the people in this region has increased drastically which created a sizable disposable income amongst the population of Asia-Pacific. Rising disposable income leads to the growth of consumer electronics market including smartphones, personal computers, laptops, smartwatches and others, this drives the global land grid array (LGA) market. Following Asia-Pacific, North America and Europe have the largest market share of 28.2% and 25.1% respectively. Market in these regions are driven by technological innovation, prominent consumer electronics market and stringent regulations pertaining to automotive and industrial sectors.

Market Competition Landscape

The land grid array (LGA) socket market worldwide is distinguished by intense rivalry among several vendors. In order to obtain a competitive advantage, major competitors in the land grid array (LGA) socket market employ certain tactics. In order to adapt to changing customer tastes, these methods include product innovation, design distinction, and the use of eco-friendly and sustainable materials. Established companies rely on their quality and dependability reputation to hold onto market share, while more recent competitors concentrate on disruptive technologies and USPs. Prominent entities in the worldwide land grid array (LGA) socket industry employ diverse organic and inorganic tactics to fortify and enhance their market standing. Leading companies in the industry include:

·         Intel Corporation

·         Advanced Micro Devices, Inc. (AMD)

·         Foxconn Technology Co., Ltd.

·         Texas Instruments Incorporated

·         Amphenol Corporation

·         Molex, LLC

·         TE Connectivity Ltd.

·         Fujitsu Limited

·         Samtec, Inc.

·         JAE Electronics, Inc.

·         Xilinx, Inc.

·         Infineon Technologies AG

·         Murata Manufacturing Co., Ltd.

·         Analog Devices, Inc.

·         Cypress Semiconductor Corporation

Report Attribute/Metric

Details

Market Revenue in 2022

USD 156.3 Million

Market Revenue in 2030

USD 258.9 Million

CAGR (2023 – 2030)

6.6%

Base Year

2022

Forecast Period

2023 – 2030

Historical Data

2018 to 2022

Forecast Unit

Value (US$ Mn)

Key Report Deliverable

Revenue Forecast, Growth Trends, Market Dynamics, Segmental Overview, Regional and Country-wise Analysis, Competition Landscape

Segments Covered

·         By Product Type (Flip Chip LGA Sockets, Pin Grid Array (PGA) Sockets, Land Grid Array (LGA) Sockets with Lead, Others)

·         By Application (Consumer Electronics, Automotive, Aerospace and Defense, Industrial, Telecommunication, Healthcare, Computing Devices, Others)

·         By End-user (Original Equipment Manufacturers (OEMs), Aftermarket)

Geographies Covered

North America: U.S., Canada and Mexico

Europe: Germany, France, U.K., Italy, Spain, and Rest of Europe

Asia Pacific: China, India, Japan, South Korea, Southeast Asia, and Rest of Asia Pacific

South America: Brazil, Argentina, and Rest of Latin America

Middle East & Africa:  GCC Countries, South Africa, and Rest of Middle East & Africa

Key Players Analyzed

Intel Corporation, Advanced Micro Devices, Inc. (AMD), Foxconn Technology Co., Ltd., Texas Instruments Incorporated, Amphenol Corporation, Molex, LLC, TE Connectivity Ltd., Fujitsu Limited, Samtec, Inc., JAE Electronics, Inc., Xilinx, Inc., Infineon Technologies AG, Murata Manufacturing Co., Ltd., Analog Devices, Inc., Cypress Semiconductor Corporation.

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